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ABOUT US

Technical & Strength

Innovation

TBS focuses on innovation, as the owner of 55 patents, including 27 invention patents, we have developed advanced packaging

Service

TBS offers customized service and a full range of turnkey services to the whole process of wafer bumping, grinding and sawing as well as packaging. 

Applications

Our products are widely applied in mobile communications, finance, mobile payment, social security, hygiene, education, transportation, logistics and IoT etc.

Product & Service

Smart card CSP module package

Smart card CSP module package

As a professional solution provider in the field of smart card packaging, TOP BUMPING SEMICONDUCTOR CO., LTD. core product —— smart card CSP module, based on technological innovation, provides high reliability and wide adaptation packaging services for various industries. The module adopts a unique WLCSP technology. With excellent structural stability and environmental adaptability, it achieves the dual advantages of "high reliability + strong applicability", and can be widely adapted to core fields such as mobile communication, finance, social security, and intelligent Internet of Things, meeting the application requirements in different scenarios. To continuously ensure the stability of production capacity and quality, the company has accelerated its strategic upgrade since 2021 With the strategic capital support from Xingzheng Investment, a wholly-owned subsidiary, " TOP BUMPING TECHNOLOGY CO., LTD. ", was established. At the same time, 1,000-level and 10,000-level high-standard purification workshops were built, and a high-level fully automatic RDL production line was set up, laying a solid foundation for large-scale and high-precision production from the hardware end. Relying on advanced technology and production systems, the company has completed multiple packaging verification and mass production cooperation of core chips at home and abroad: successfully adapted to the S3D* series chips of South Korea, the SLC3* series chips of Europe, and the series chips of leading chip manufacturers in the Chinese mainland, achieving deep compatibility with mainstream chip platforms. With strict quality control, it has consecutively passed the CQM (Mastercard) supplier qualification certification for overseas customers at the Grade-B level for two times, and its product quality has been recognized by international authorities. Up to now, the company has delivered billions of CSP communication modules and dual interface modules to customers around the world.  At the same time, the company has a stable and professional technical team, always "customer satisfaction" as the core, continue to provide high-value module products and packaging services, become the global customers trust long-term partners. 
Wafer-Level Chip Scale Packaging (WLCSP)

Wafer-Level Chip Scale Packaging (WLCSP)

Applies own chip pad bumping and RDL technology to Wafer-Level Chip Scale Packaging (WLCSP), which is suitable for power devices, driver IC and smart card chip package assembly. The technology reliability has been fully verified by the market.
Wafer bumping

Wafer bumping

The wafer bumping adopts a unique chemical processing technology of chip pad bumping and is applied to LCD Driver IC, Mini/Micro LED, is cost-competitive and with high reliability.
CP test, grinding and sawing

CP test, grinding and sawing

Under construction

News

Voice of Entrepreneur

07-29

2019

Voice of Entrepreneur
Duan Li, Chairman of Xiamen TBS Technology Co., Ltd.: Five years of growth experience witnessing Xiamen's good business environment On July 29, 2019, the Xiamen “Three Highs” Enterprise Development Conference announced a series of policies and measures to support the accelerated development of “Three Highs” enterprises. Through “precise drip irrigation” and considerate services, it effectively creates a good ecology of innovation and entrepreneurship and accelerates modern The industry leapt and developed. TBS’s five-year growth experience in Xiamen has witnessed a good business environment in Xiamen. The introduction of the "Three Highs" corporate policy has strengthened our confidence.
The 4th Cross-Strait Talent Organization Fair was held in Xiamen

06-18

2019

The 4th Cross-Strait Talent Organization Fair was held in Xiamen
The 11th Straits Forum and the 4th Cross-Strait Talent Organization Fair was held in Xiamen.
Xiamen Customs Xiang'an Office's outbound processing filing amount exceeded US$10 million for the first time

05-15

2018

Xiamen Customs Xiang'an Office's outbound processing filing amount exceeded US$10 million for the first time
A few days ago, Xiamen Customs Office in Xiang'an approved and issued Xiamen TBS Technology Co., Ltd. outbound processing account books. The total amount of account records filed reached 10.32 million US dollars, which was the largest amount filed in Xiamen Customs District. Outbound processing account book.

Tel：0592-7687518　　Email：chenyiling@topbumping.com

Add：E502B Yucheng Center of Taiwan Science and Technology Enterprises, Xiamen Torch (Xiang'an) Industrial Zone, Xiamen, Fujian, China.

Copyright©Top Bumping Semiconductor Co., Ltd.
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Tel: 0592-7687518　　

Email: chenyiling@topbumping.com

Add: E502B Yucheng Center of Taiwan Science and Technology Enterprises,Xiamen Torch (Xiang'an) Industrial Zone, Xiamen Fujian,China.

Copyright©Top Bumping Semiconductor Co., Ltd.
Verification 闽ICP备19025830号-2
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