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Wafer-Level Chip Scale Packaging (WLCSP)
MSSB applies own chip pad bumping and RDL technology to Wafer-Level Chip Scale Packaging (WLCSP), which is suitable for power devices, driver IC and smart card chip package assembly. The technology reliability has been fully verified by the market.
Wafer-Level Chip Scale Packaging (WLCSP)
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Tel：0592-7687518 Email：chenyiling@mssb-xm.com
Add：E502B Yucheng Center of Taiwan Science and Technology Enterprises, Xiamen Torch (Xiang'an) Industrial Zone, Xiamen, Fujian, China.
Tel: 0592-7687518
Email: chenyiling@mssb-xm.com
Add：E502B Yucheng Center of Taiwan Science and Technology Enterprises,Xiamen Torch (Xiang'an) Industrial Zone, Xiamen Fujian,China.
