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Wafer bumping
The wafer bumping adopts a unique chemical processing technology of chip pad bumping and is applied to LCD Driver IC, Mini/Micro LED, is cost-competitive and with high reliability.
Wafer bumping
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Tel:0592-7687518 Email:chenyiling@mssb-xm.com
Add:E502B Yucheng Center of Taiwan Science and Technology Enterprises, Xiamen Torch (Xiang'an) Industrial Zone, Xiamen, Fujian, China.
Tel: 0592-7687518
Email: chenyiling@mssb-xm.com
Add:E502B Yucheng Center of Taiwan Science and Technology Enterprises,Xiamen Torch (Xiang'an) Industrial Zone, Xiamen Fujian,China.