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Innovation
- Categories:Technical strength
- Time of issue:2020-06-30 00:00:00
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Description:
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MSSB focuses on innovation, as the owner of 55 patents, including 27 invention patents, we have developed advanced packaging technologies such as Wafer RDL and chip pad bumping. |
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Tel：0592-7687518 Email：chenyiling@mssb-xm.com
Add：E502B Yucheng Center of Taiwan Science and Technology Enterprises, Xiamen Torch (Xiang'an) Industrial Zone, Xiamen, Fujian, China.
Tel: 0592-7687518
Email: chenyiling@mssb-xm.com
Add：E502B Yucheng Center of Taiwan Science and Technology Enterprises,Xiamen Torch (Xiang'an) Industrial Zone, Xiamen Fujian,China.
