Company Profile

Top Bumping Semiconductor Co., Ltd. (Xiamen MSSB Technology Co., Ltd)was established in February 2015 and is located in Xiamen, a National Ecological Garden City, which is also called Ludao. Its industrial base is located in the Torch High-tech Zone (Xiang'an) Industrial Zone. TBS offers customized service and a full range of turnkey services to the whole process of wafer bumping, grinding and sawing as well as packaging. We replace the traditional vacuum sputtering and electroplating technology with unique chemical processing technology of chip pad bumping.

TBS focuses on innovation, as the owner of 55 patents, including 27 invention patents, we have developed advanced packaging technologies such as Wafer RDL and chip pad bumping. Our products are widely applied in mobile communications finance, mobile payment, social security, hygiene, education, transportation, logistics and IoT etc. We stick to provide our customers with good products and services, have got the ISO9001:2015 quality management system certification and been widely recognized by customers worldwide.

TBS has got many rewards by local government and won the title of National High-Tech Enterprise in 2018.

The company is committed to becoming an international Wafer-Level Chip Scale Packaging and module packaging provider with advanced solutions and good services.