On August 8th, Xiamen Yucheng Center of Taiwan Science and Technology Enterprises celebrated with lanterns and festivities. Representatives of famous domestic companies in the smart IC card industry such as Tongfang Microelectronics, G&D (China), Hengbao, Datang Smart Card, Eastcom and Pingtong gathered together and celebrated the opening of Xiamen MSSB Technology Co., Ltd..

Xiamen MSSB Co., Ltd. is a high-tech enterprise established by the cooperation of veterans from both sides of the strait, mainly to introduce the world's invention patents in the field of smart cards in Taiwan. Its industrial positioning is the development and application of integrated circuit packaging technology. The selected products are silicon chip packaging technology (WLCSP: Wafer Level Chip Scale Packaging) package smart card chip module.

WLCSP technology packaging has been widely used in many electronic products, especially electronic products that have high requirements for product thickness and component density, such as mobile phones and tablet computers. MSSB used authorized patents and improved and upgraded WLCSP chip module products suitable for the smart card field. After testing by national authoritative testing institutions and customers, MSSB’s product quality is reliable and meets the requirements of international and domestic related products. standard requirement.

MSSB has established 100 million capacity per year of WLCSP chip module products, and plans to increase the capacity of WLCSP chip modules to 1.2 billion per year in 5 years to help the development of China’s IC card industry.

(Entrepreneurship Center Li Chunfu)